Rapidus Establishes R&D Center for Semiconductor Post-Processing
Rapidus Corp. will set up a clean room within Seiko Epson Corp.’s facility in Chitose, Hokkaido, and open an R&D center for semiconductor post-processing called...
semiconductor innovation
Hybrid Bonding Technology Set to Revolutionize the Chip Industry
Hybrid bonding, also known as direct-bond interconnect, is poised to transform a semiconductor industry wrestling with Moore’s Law slowing as market demands for...
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