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  RTL8723BU: High-Performance USB 2.0 Wi-Fi and Bluetooth Combo Solution

  By：EE Newsroom EE Newsroom

SoftBank To Build Japan’s Largest AI Supercomputer With NVIDIA’s Blackwell AI Chips

By：EE Newsroom Oct 10, 2024

Amazon steps up effort to build AI chips that can rival Nvidia

By：EE Newsroom Oct 10, 2024

Qualcomm unveils new chips for smart home gadgets

By：EE Newsroom Oct 10, 2024

Renesas Entry-Line MCUs Integrate Arm Helium Technology

By：EE Newsroom Oct 10, 2024

Keysight and ADI Partner to Develop GMSL Testing Methodology

By：EE Newsroom Oct 10, 2024

Intel Plans to Manufacture Most of Next-Gen PC Chip Lineup Internally

By：EE Newsroom Oct 10, 2024

TSMC Set to Receive ASML's Next-Gen Chip Machines This Year

By：EE Newsroom Oct 10, 2024

Global Helium Shortage Affects Chip Production at TSMC and Intel

By：EE Newsroom Oct 10, 2024

OpenAI Develops Proprietary AI Chips to Compete with NVIDIA's Dominance

By：EE Newsroom Oct 10, 2024

South Korea’s Chip Production Declines for the First Time in Over a Year

By：EE Newsroom Oct 10, 2024